New GC G-Premio Bond Light Cured Universal Adhesive 8th Generation Refill of 5ml

Description

DESCRIPTION
GC G-Premio BOND
G-Premio BOND is a universal, 8th generation bonding agent that is compatible with total-etch, self-etch and selective etch techniques providing excellent versatility. It is perfectly adapted to all direct restorations and can also be used to repair indirect restorations without the use of primer. G-Premio BOND can also be used in combination with a silane when repairing glass or hybrid ceramic and is also ideal for hypersensitivity. It is available in a bottle (5 mL) with a new silicone cover to enable more precise drop dispensing
OUTSTANDING PERFORMANCE WITH ALL ETCHING MODES AND IN ALL CLINICAL SITUATIONS.
A unique combination of three functional monomers (4-MET, MDP and MDTP), notably excluding HEMA, ensures excellent stability and exceptional bond strengths not just to tooth tissue but to all indirect substrates, including composites, precious and non-precious metals, zirconia and alumina for all repair cases.
HOW TO USE:
LEAVE UNDISTURBED FOR 10 SECONDS AFTER APPLICATION. DRY THOROUGHLY FOR 5 SECONDS UNDER MAXIMUM AIR PRESSURE AND LIGHT CURE FOR 10 SECONDS. FOR THE SELECTIVE ETCHING APPROACH, APPLY 35% – 40% PHOSPHORIC ACID ON ENAMEL FOR 10 SECONDS PRIOR TO THE APPLICATION OF THE BONDING.
APPLICATION TIME:
30 seconds from application time to light-cure
Bonding Layer Thickness: Less than 3 µM
Advantages:
Can be used as self-etch adhesive or with selective etching of enamel
Creation of a nano-interaction zone for superior bond strength to both enamel and dentin
Excellent marginal integrity regardless of the technique and the composite material
HEMA-free for a long-lasting bond
Clinical reliability proven in independent tests
5% filler seals tubules leads to fewer voids between the thin adhesive layer and the dentin, which minimizes microleakage and prevents microbial invasion
Available in updated-design bottle or unit dose delivery
Benefits:
Low pH (1.5) provides effective and consistent bonding
Use in all total-etch, self-etch and selective etch bonding techniques
Low film thickness (3 microns) enables use with resin cements to bond indirect restorations
Universal (8th generation) bonding agent for use in direct and indirect procedures and treatment of hypersensitivity
Up to 5 minutes working time
Consistent bond strength with easy application
Better dispensing control and less waste with new silicone bottle design.
Fast technique (10 second placement and 25 seconds before placing composite)
EXPIRY 2023/12
DISCLAIMER
The sale of this item may be subject to regulation by the U.S. Food and Drug Administration and state and local regulatory agencies. If so, please not bid on this item unless you are an authorized purchaser. If the item is subject to FDA regulation, I will verify your status as an authorized purchaser of this item before shipping of the item.